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  1. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

bga1 fold-over1 fbga1 fine pitch bga1 land grid array1 ball grid array1 csp1 chip scale package1 integrated passives1 die stacking1

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